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Opis

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

Szczegóły książki

Kategoria Książki po angielsku Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Pełny tytuł: High-Frequency Characterization of Electronic Packaging
• Autor: Luc Martens
• Język: Angielski
• Oprawa: Twarda
• Liczba stron: 158
• EAN: 9780792383079
• ISBN: 0792383079
• ID: 01397544
• Wydawca: Springer
• Waga: 940 g
• Wymiary: 235 × 155 × 14 mm
• Data wydania: 31. October 1998

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