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Viac informácií o knihe Wafer Level 3-D ICs Process Technology

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Anotácia knihy

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

Parametre knihy

Zaradenie knihy Książki po angielsku Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Wafer Level 3-D ICs Process Technology
• Autor: Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif
• Jazyk: Angličtina
• Väzba: Brožovaná
• Počet strán: 410
• EAN: 9781441945624
• ISBN: 1441945628
• ID: 01423024
• Nakladateľ: Springer-Verlag New York Inc.
• Hmotnosť: 632 g
• Rozmery: 235 × 155 × 20 mm
• Dátum vydania: 28. October 2010

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