Code: 06667235
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and eco ... more
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Book synopsis
Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer lev
Book details
Book category Books in English Technology, engineering, agriculture Mechanical engineering & materials Materials science
159.76 €
English
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