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Book synopsis

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: 3D Stacked Chips
• Subtitle: From Emerging Processes to Heterogeneous Systems
• Author: Ibrahim M. Elfadel, Gerhard Fettweis
• Language: English
• Binding: Hardback
• Number of pages: 339
• EAN: 9783319204802
• ISBN: 3319204807
• ID: 09339827
• Publisher: Springer International Publishing AG
• Weight: 694 g
• Dimensions: 166 × 241 × 26 mm
• Date of publishing: 11. May 2016

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