Code: 06423929
Advanced Ta-Based Diffusion Barriers for Cu Interconnects
by Rene Hubner
Copper has become the standard metallisation material for on-chip interconnects in high-performance microprocessors. This book intends to carry out microstructure and functional property investigations for advanced, high-performan ... more
- Language:
English - Binding: Paperback
- Number of pages: 102
Publisher: Nova Science Publishers Inc, 2009
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Book synopsis
Copper has become the standard metallisation material for on-chip interconnects in high-performance microprocessors. This book intends to carry out microstructure and functional property investigations for advanced, high-performance Tabased diffusion barriers before and after annealing to compare their thermal stabilities.
Book details
Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
50.32 €
- Full title: Advanced Ta-Based Diffusion Barriers for Cu Interconnects
- Author: Rene Hubner
- Language: English
- Binding: Paperback
- Number of pages: 102
- EAN: 9781604564518
- ISBN: 9781604564518
- ID: 06423929
- Publisher: Nova Science Publishers Inc
- Weight: 192 g
- Dimensions: 227 × 153 × 8 mm
- Date of publishing: 17. March 2009
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