Code: 07181188
Area Array Package Design
by Ken Gilleo
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital inform ... more
- Language:
English - Binding: Paperback
- Number of pages: 220
Publisher: McGraw-Hill, 2003
- More about this
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Book synopsis
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
Book details
Book category Books in English Technology, engineering, agriculture Technology: general issues Engineering: general
137.77 €
- Full title: Area Array Package Design
- Author: Ken Gilleo
- Language: English
- Binding: Paperback
- Number of pages: 220
- EAN: 9780071737739
- ISBN: 9780071737739
- ID: 07181188
- Publisher: McGraw-Hill
- Weight: 386 g
- Dimensions: 235 × 190 × 12 mm
- Date of publishing: 24. October 2003
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