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Book synopsis

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Area Array Packaging Processes
• Author: Ken Gilleo
• Language: English
• Binding: Paperback
• Number of pages: 272
• EAN: 9780071738019
• ISBN: 9780071738019
• ID: 07181199
• Publisher: McGraw-Hill Education - Europe
• Weight: 474 g
• Dimensions: 191 × 235 × 14 mm
• Date of publishing: 23. October 2003

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