Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices / Najlacnejšie knihy
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Code: 32905881

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

by SUHIR

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The ... more

224.66


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Book synopsis

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

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224.66

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