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Book synopsis

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Book details

Book category Books in English Computing & information technology Computer programming / software development

• Full title: Chip On Board
• Subtitle: Technology for Multichip Modules
• Author: John H. Lau
• Language: English
• Binding: Hardback
• Number of pages: 556
• EAN: 9780442014414
• ISBN: 0442014414
• ID: 01387501
• Publisher: Springer, Berlin
• Weight: 984 g
• Dimensions: 234 × 156 × 31 mm
• Published: 1994

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