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Title synopsis

This proceedings collection on CD-ROM is from the 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT)held in April, 2005. This is a must-have resource for anyone involved in the Microelectronics field. Topics covered include Materials Solutions for Microsystems, Cofiring Processes, Microsystem Materials Integration, Dimensional Control in LTCC Systems, Ceramic Microsystem Applications and much more.

Title details

Title category Books in English Technology, engineering, agriculture Mechanical engineering & materials

• Full title: CICMT 2005 Ceramic Interconnect and Ceramic Microsystems Technologies
• Subtitle: Proceedings and Exhibitor Presentations Held April 10-13, 2005, Baltimore, Maryland
• Author: Mike Ehlert, Kevin G. Ewsuk
• Language: English
• Binding: Digital
• EAN: 9780930815769
• ID: 04948375
• Publisher: John Wiley & Sons Inc
• Weight: 24 g
• Dimensions: 132 × 131 × 1 mm
• Date of publishing: 07. April 2006

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