Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs / Najlacnejšie knihy
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Code: 13816997

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

by Brandon Noia, Krishnendu Chakrabarty

This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testin ... more

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Book synopsis

This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.

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Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

103.53 €

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