Code: 04884809

Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC

Name: Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC
Brand: John Wiley & Sons Inc
SKU: 04884809
Price: 131.41 EUR
Availability: InStock
Author: Er-Ping Li
ISBN: 9780470623466

by Er-Ping Li

Language: English
Binding: Hardback
Number of pages: 384
Publisher: John Wiley & Sons Inc, 2012
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More about Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC

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Book synopsis

The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants.

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Book category Books in English Mathematics & science Mathematics Applied mathematics

131.41 €

Full title: Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC
Author: Er-Ping Li
Language: English
Binding: Hardback
Number of pages: 384
EAN: 9780470623466
ISBN: 0470623462
ID: 04884809
Publisher: John Wiley & Sons Inc
Weight: 774 g
Dimensions: 241 × 156 × 18 mm
Date of publishing: 19. April 2012