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Book synopsis

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Electronic Packaging for High Reliability, Low Cost Electronics
• Author: Rao R. Tummala, Marija Kosec, W. Kinzy Jones, Darko Belavic
• Language: English
• Binding: Hardback
• Number of pages: 296
• EAN: 9780792352181
• ISBN: 0792352181
• ID: 01395791
• Publisher: Springer
• Weight: 1360 g
• Dimensions: 235 × 155 × 21 mm
• Date of publishing: 29. February 2000

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