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Book synopsis

Electrostatic discharge (ESD) is one of the most prevalent threats to electronic components. In an ESD event, a finite amount of charge is transferred from one object (i.e., human body) to another (i.e., microchip). This process can result in a very high current passing through the microchip within a very short period of time. Thus, more than 35 percent of single-event chip damages can be attributed to ESD events, and designing ESD structures to protect integrated circuits against the ESD stresses is a high priority in the semiconductor industry.

Electrostatic Discharge Protection: Advances and Applications delivers timely coverage of component- and system-level ESD protection for semiconductor devices and integrated circuits. Bringing together contributions from internationally respected researchers and engineers with expertise in ESD design, optimization, modeling, simulation, and characterization, this book bridges the gap between theory and practice to offer valuable insight into the state of the art of ESD protection.

Amply illustrated with tables, figures, and case studies, the text:

• Instills a deeper understanding of ESD events and ESD protection design principles
• Examines vital processes including Si CMOS, Si BCD, Si SOI, and GaN technologies
• Addresses important aspects pertinent to the modeling and simulation of ESD protection solutions

Electrostatic Discharge Protection: Advances and Applications provides a single source for cutting-edge information vital to the research and development of effective, robust ESD protection solutions for semiconductor devices and integrated circuits.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Electrostatic Discharge Protection
• Author: Juin J. Liou
• Language: English
• Binding: Paperback
• Number of pages: 320
• EAN: 9781138893078
• ISBN: 9781138893078
• ID: 16205335
• Publisher: Taylor & Francis Ltd
• Weight: 590 g
• Dimensions: 234 × 156 mm
• Date of publishing: 26. July 2017

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