Code: 05349964
Embedded Dielectrics for Electronic Packaging
by Shuhui Yu, Ching-Ping Wong, Rong Sun
This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing etc. So ... more
- Language:
English - Binding: Hardback
- Number of pages: 300
Publisher: World Scientific Publishing Co Pte Ltd, 2015
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Book synopsis
This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.
Book details
Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
177.78 €
- Full title: Embedded Dielectrics for Electronic Packaging
- Author: Shuhui Yu, Ching-Ping Wong, Rong Sun
- Language: English
- Binding: Hardback
- Number of pages: 300
- EAN: 9789814619417
- ISBN: 9814619418
- ID: 05349964
- Publisher: World Scientific Publishing Co Pte Ltd
- Weight: 406 g
- Date of publishing: 30. June 2015
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