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Book synopsis

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Encapsulation Technologies for Electronic Applications
• Author: Jiawei Zhang
• Language: English
• Binding: Paperback
• Number of pages: 508
• EAN: 9780128119785
• ISBN: 0128119780
• ID: 18889945
• Publisher: William Andrew Publishing
• Weight: 790 g
• Dimensions: 229 × 152 × 24 mm
• Date of publishing: 11. October 2018

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