Foldable Flex and Thinned Silicon Multichip Packaging Technology / Najlacnejšie knihy
Foldable Flex and Thinned Silicon Multichip Packaging Technology

Code: 05181543

Foldable Flex and Thinned Silicon Multichip Packaging Technology

by John W. Balde

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the c ... more

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Book synopsis

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.§

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Book category Books in English Mathematics & science Chemistry Physical chemistry

153.91 €

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