Hybrid Assemblies and Multichip Modules / Najlacnejšie knihy
Hybrid Assemblies and Multichip Modules

Code: 06696303

Hybrid Assemblies and Multichip Modules

by Fred W. Kear

Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wi ... more

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Book synopsis

Offering a description of design considerations from the user's viewpoint, this reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. It provides an overview of substrate materials and metals used for conductors.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

224.15

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