Code: 06699473
Introduction to Microsystem Packaging Technology
by Jing Chen
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly M ... more
- Language:
English - Binding: Hardback
- Number of pages: 232
Publisher: Taylor & Francis Inc, 2010
- More about this
257.52 €
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Book synopsis
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
Book details
Book category Books in English Technology, engineering, agriculture Industrial chemistry & manufacturing technologies Other manufacturing technologies
257.52 €
- Full title: Introduction to Microsystem Packaging Technology
- Author: Jing Chen
- Language: English
- Binding: Hardback
- Number of pages: 232
- EAN: 9781439819104
- ISBN: 9781439819104
- ID: 06699473
- Publisher: Taylor & Francis Inc
- Weight: 574 g
- Dimensions: 180 × 253 × 19 mm
- Date of publishing: 29. September 2010
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