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Book synopsis

Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.

Book details

Book category Books in English Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Full title: Materials for High-Temperature Semiconductor Devices
• Author: Committee on Materials for High-Temperature Semiconductor Devices, Commission on Engineering and Technical Systems, National Materials Advisory Board,
• Language: English
• Binding: Paperback
• Number of pages: 136
• EAN: 9780309053358
• ISBN: 0309053358
• ID: 04576396
• Publisher: National Academies Press
• Weight: 406 g
• Dimensions: 279 × 216 mm
• Date of publishing: 14. September 1995

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