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Book synopsis

This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.

Book details

Book category Books in English Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Full title: Materials Reliability in Microelectronics V: Volume 391
• Author: William F. Filter, Kamesh Gadepally, A. Lindsay Greer, Anthony S. Oates, Robert Rosenberg
• Language: English
• Binding: Hardback
• Number of pages: 523
• EAN: 9781558992948
• ISBN: 1558992944
• ID: 02060054
• Publisher: Materials Research Society
• Weight: 886 g
• Dimensions: 234 × 157 × 33 mm
• Date of publishing: 24. October 1995

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