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Title synopsis

The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.

Title details

Title category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Microelectronics Packaging Handbook on CD-ROM
• Author: Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
• Language: English
• Binding: CD
• Number of pages: 1000
• EAN: 9780412085611
• ISBN: 0412085615
• ID: 05248292
• Publisher: Chapman and Hall
• Weight: 296 g
• Dimensions: 178 × 174 × 30 mm
• Date of publishing: 01. March 1998

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