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Book synopsis

The field of packaging of photonic devices is very broad and diverse. This book is the first and only comprehensive sourcebook on photonic assembly techniques. For photonic packaging experts and professionals in corresponding technologies, it provides an overview of today's state-of-the-art technologies. From basic calculations to optimize the fiber chip coupling efficiency, the content will guide the reader to the practical use of optical connectors. Active and passive adjustment and coupling basics in combination with many examples will help the engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of actual industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Up to date simulation techniques like FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Photonic Packaging Sourcebook
• Subtitle: Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
• Author: Ulrich H. P. Fischer-Hirchert
• Language: English
• Binding: Hardback
• Number of pages: 325
• EAN: 9783642253751
• ISBN: 364225375X
• ID: 05281378
• Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
• Weight: 6447 g
• Dimensions: 235 × 155 × 24 mm
• Date of publishing: 22. April 2015

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