Physical Design for Multichip Modules / Najlacnejšie knihy
Physical Design for Multichip Modules

Code: 01398239

Physical Design for Multichip Modules

by Mysore Sriram, Sung-Mo (Steve) Kang

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published r ... more

154.36

RRP: 167.22 €

You save 12.87 €


In stock at our supplier
Shipping in 10 - 13 days
Add to wishlist

You might also like

Give this book as a present today
  1. Order book and choose Gift Order.
  2. We will send you book gift voucher at once. You can give it out to anyone.
  3. Book will be send to donee, nothing more to care about.

Book gift voucher sampleRead more

More about Physical Design for Multichip Modules

You get 373 loyalty points

Book synopsis

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

154.36

Trending among others



Collection points Bratislava a 12868 dalších

Copyright ©2008-26 najlacnejsie-knihy.sk All rights reservedPrivacyCookies


Account: Log in
Všetky knihy sveta na jednom mieste. Navyše za skvelé ceny.

Shopping cart ( Empty )

For free shipping
shop for 59,99 € and more

You are here: