Code: 09062257
RF and Microwave Microelectronics Packaging
by Sean S. Cahill, Franklin Kim, Ken Kuang
This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW ... more
- Language:
English - Binding: Paperback
- Number of pages: 285
Publisher: Springer-Verlag New York Inc., 2014
- More about this
154.20 €
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Book synopsis
This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.§
Book details
Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
154.20 €
- Full title: RF and Microwave Microelectronics Packaging
- Author: Sean S. Cahill, Franklin Kim, Ken Kuang
- Language: English
- Binding: Paperback
- Number of pages: 285
- EAN: 9781489983244
- ISBN: 9781489983244
- ID: 09062257
- Publisher: Springer-Verlag New York Inc.
- Weight: 468 g
- Dimensions: 235 × 155 × 16 mm
- Date of publishing: 05. September 2014
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