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Book synopsis

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Semiconductor Advanced Packaging
• Author: John H. Lau
• Language: English
• Binding: Paperback
• Number of pages: 498
• EAN: 9789811613784
• ID: 39124513
• Publisher: Springer Verlag, Singapore
• Weight: 789 g
• Dimensions: 235 × 155 × 28 mm
• Date of publishing: 19. May 2022

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