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Book synopsis

The trend towards miniaturisation of microelectronic devices and the search for exotic new optoelectronic devices based on multilayers confer a crucial role on semiconductor interfaces. Great advances have recently been achieved in the elaboration of new thin film materials and in the characterization of their interfacial properties, down to the atomic scale, thanks to the development of sophisticated new techniques. This book is a collection of lectures that were given at the International Winter School on Semiconductor Interfaces: Formation and Properties held at the Centre de Physique des Rouches from 24 February to 6 March, 1987. The aim of this Winter School was to present a comprehensive review of this field, in particular of the materials and methods, and to formulate recom mendations for future research. The following topics are treated: (i) Interface formation. The key aspects of molecular beam epitaxy are emphasized, as well as the fabrication of artificially layered structures, strained layer superlattices and the tailoring of abrupt doping profiles. (ii) Fine characterization down to the atomic scale using recently devel oped, powerful techniques such as scanning tunneling microscopy, high reso lution transmission electron microscopy, glancing incidence x-ray diffraction, x-ray standing waves, surface extended x-ray absorption fine structure and surface extended energy-loss fine structure. (iii) Specific physical properties of the interfaces and their prospective applications in devices. We wish to thank warmly all the lecturers and participants, as well as the organizing committee, who made this Winter School a success.

Book details

Book category Books in English Mathematics & science Physics Materials / States of matter

• Full title: Semiconductor Interfaces: Formation and Properties
• Author: Nino Boccara, Jacques Derrien, Guy Lelay
• Language: English
• Binding: Paperback
• Number of pages: 389
• EAN: 9783642729690
• ISBN: 9783642729690
• ID: 06624471
• Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
• Weight: 662 g
• Dimensions: 245 × 173 × 21 mm
• Date of publishing: 06. December 2011

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