Code: 06721699
Semiconductor Packaging
by Randy Hsiao-Yu Lo
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a f ... more
- Language:
English - Binding: Hardback
- Number of pages: 216
Publisher: Taylor & Francis Inc, 2011
- More about this
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Book synopsis
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundame
Book details
Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
288.74 €
- Full title: Semiconductor Packaging
- Subtitle: Materials Interaction and Reliability
- Author: Randy Hsiao-Yu Lo
- Language: English
- Binding: Hardback
- Number of pages: 216
- EAN: 9781439862056
- ISBN: 9781439862056
- ID: 06721699
- Publisher: Taylor & Francis Inc
- Weight: 472 g
- Dimensions: 241 × 156 × 17 mm
- Date of publishing: 10. October 2011
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