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Book synopsis

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Solder Joint Reliability Prediction for Multiple Environments
• Author: Andrew E. Perkins, Suresh K. Sitaraman
• Language: English
• Binding: Hardback
• Number of pages: 192
• EAN: 9780387793931
• ISBN: 0387793933
• ID: 01383161
• Publisher: Springer-Verlag New York Inc.
• Weight: 489 g
• Dimensions: 235 × 155 × 16 mm
• Date of publishing: 23. October 2008

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