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Book synopsis

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.

Book details

Book category Books in English Technology, engineering, agriculture Mechanical engineering & materials Engineering skills & trades

• Full title: Electronics Assembly Handbook
• Author: Frank Riley, lectronic Packaging and Production
• Language: English
• Binding: Paperback
• Number of pages: 603
• EAN: 9783662131633
• ISBN: 3662131633
• ID: 02182805
• Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
• Weight: 1343 g
• Dimensions: 36 × 203 × 34 mm
• Date of publishing: 08. March 2013

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