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Book synopsis

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. * Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers * The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find * Focuses on design issues key to the product development cycle. ..good design plays a major role in exploiting the implementation flexibilities offered in the 3-D * Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits

Book details

Book category Books in English Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Full title: Three-dimensional Integrated Circuit Design
• Author: Friedman
• Language: English
• Binding: Paperback
• Number of pages: 336
• EAN: 9780123743435
• ISBN: 0123743435
• ID: 04020880
• Publisher: Elsevier Science & Technology
• Weight: 726 g
• Dimensions: 242 × 199 × 24 mm
• Date of publishing: 25. September 2008

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