Code: 01435032
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
by K. Otsuka
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in ... more
- Language:
English - Binding: Hardback
- Number of pages: 242
Publisher: Kluwer Academic Publishers Group, 1993
- More about this
308.42 €
RRP: 334.12 €
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Book synopsis
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
Book details
Book category Books in English Technology, engineering, agriculture Industrial chemistry & manufacturing technologies Industrial chemistry
308.42 €
- Full title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
- Subtitle: Ceramic research and development in Japan
- Author: K. Otsuka
- Language: English
- Binding: Hardback
- Number of pages: 242
- EAN: 9781851665792
- ISBN: 185166579X
- ID: 01435032
- Publisher: Kluwer Academic Publishers Group
- Weight: 1200 g
- Dimensions: 254 × 178 × 19 mm
- Date of publishing: 30. April 1993
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