Code: 09043704
3D IC Integration and Packaging
by John Lau
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
- Language:
English - Binding: Hardback
- Number of pages: 480
Publisher: McGraw-Hill Education - Europe, 2015
- More about this
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Book synopsis
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
Book details
Book category Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
215.86 €
- Full title: 3D IC Integration and Packaging
- Author: John Lau
- Language: English
- Binding: Hardback
- Number of pages: 480
- EAN: 9780071848060
- ISBN: 9780071848060
- ID: 09043704
- Publisher: McGraw-Hill Education - Europe
- Weight: 1028 g
- Dimensions: 245 × 196 × 28 mm
- Date of publishing: 27. August 2015
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