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Viac informácií o knihe Advances in Rapid Thermal and Integrated Processing

• Parametre knihy
• Anotácia kniha
• Obľúbené z iného súdka

Nákupom získate 1396 bodov

Anotácia knihy

Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Advances in Rapid Thermal and Integrated Processing
• Autor: F. Roozeboom
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 566
• EAN: 9780792340119
• ISBN: 0792340116
• ID: 01395064
• Nakladateľ: Springer
• Hmotnosť: 2180 g
• Rozmery: 235 × 155 × 37 mm
• Dátum vydania: 31. March 1996

Obľúbené z iného súdka

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