Coupled Data Communication Techniques for High-Performance and Low-Power Computing / Najlacnejšie knihy
Coupled Data Communication Techniques for High-Performance and Low-Power Computing

Kód: 01424016

Coupled Data Communication Techniques for High-Performance and Low-Power Computing

Autor Ron Ho, Robert Drost

This book provides an overview of the circuits, architectures, and chip packaging for coupled data techniques. It discusses the current research in chip-to-board capacitive coupling, chip-to-chip capacitive coupling, chip-to-chip ... celý popis

214.64


Skladom u dodávateľa v malom množstve
Odosielame za 12 - 15 dní

Potrebujete viac kusov?Ak máte záujem o viac kusov, preverte, prosím, najprv dostupnosť titulu na našej zákazníckej podpore.


Pridať medzi želanie

Mohlo by sa vám tiež páčiť

Darujte túto knihu ešte dnes
  1. Objednajte knihu a vyberte Zaslať ako darček.
  2. Obratom obdržíte darovací poukaz na knihu, ktorý môžete ihneď odovzdať obdarovanému.
  3. Knihu zašleme na adresu obdarovaného, o nič sa nestaráte.

Viac informácií

Viac informácií o knihe Coupled Data Communication Techniques for High-Performance and Low-Power Computing

Nákupom získate 530 bodov

Anotácia knihy

This book provides an overview of the circuits, architectures, and chip packaging for coupled data techniques. It discusses the current research in chip-to-board capacitive coupling, chip-to-chip capacitive coupling, chip-to-chip inductive coupling, and chip-to-chip optical coupling. Circuits, modeling, and their implications for packaging are explored in depth. Mechanical methods to ensure accurate and sustained chip alignment are discussed, as well as electrical methods to compensate for resulting misalignment. Finally, the book covers issues raised by design for manufacturing and test. §This book is one of the first in a new and emerging area. Coupled data communication offers new ways of looking at the old problem of limited off-chip I/O: it trades off packaging complexity for I/O performance; it offers a set of enabling technologies for 3D or stacked-chip architectures; and it raises the possibility of replace-able chips--and thus high yield--in an MCM.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

214.64

Obľúbené z iného súdka



Osobný odber Bratislava a 2642 dalších

Copyright ©2008-24 najlacnejsie-knihy.sk Všetky práva vyhradenéSúkromieCookies


Môj účet: Prihlásiť sa
Všetky knihy sveta na jednom mieste. Navyše za skvelé ceny.

Nákupný košík ( prázdny )

Vyzdvihnutie v Zásielkovni
zadarmo nad 59,99 €.

Nachádzate sa: