You might also like

More about Crafting the Future of International Higher Education in Asia via Systems Change and Innovation

• Book details
• Synopsis
• Trending among others

You get 623 loyalty points

Book synopsis

Professor Jane Knight, Ontario Institute for studies in Education, University of TorontoThis timely and well-researched book provides valuable insights into the challenges and opportunities for national, regional, and international higher education created by the recent pandemic as well as technological and geopolitical changes. The lucid analysis of key issues and trends will be useful to academics, policymakers, and researchers within Asia and beyond.Professor Gerard Postiglione, Emeritus Professor, The University of Hong KongThis book sets out important thinking for the post-pandemic era in Asian higher education. Based on valuable experience across a diverse region, this book highlights the opportunity to reimagine the future trajectory for higher education. As more of the Asia-Pacific moves toward mass and even universal systems of higher education, it exerts greater influence on higher education around the world. This book offers practical analysis that is culturally grounded in the rich civilizations of Asia about ubiquitous issues in higher education, including social equity, human agency, program quality, innovative pedagogy, academic governance, private sector initiative, knowledge building, and a new form of internationalization. It offers a sensible launchpad for a policy agenda.

Book details

Book category Knihy po anglicky Society & social sciences Education Higher & further education, tertiary education

• Full title: Crafting the Future of International Higher Education in Asia via Systems Change and Innovation
• Subtitle: Reimagining New Modes of Cooperation in the Post Pandemic
• Author: Angela Yung-Chi Hou, Joshua Smith, Ka Ho Mok, Chao-Yu Guo
• Language: English
• Binding: Hardback
• Number of pages: 240
• EAN: 9789819918737
• ID: 43100572
• Publisher: Springer, Berlin
• Dimensions: 235 × 155 mm
• Date of publishing: 29. August 2023

---

---

---