Experimental and Simulation-based Investigations on the Influence of Thermal Aging and Humidity on the Warpage of Molded Plastic Packages / Najlacnejšie knihy
Experimental and Simulation-based Investigations on the Influence of Thermal Aging and Humidity on the Warpage of Molded Plastic Packages

Kód: 13415764

Experimental and Simulation-based Investigations on the Influence of Thermal Aging and Humidity on the Warpage of Molded Plastic Packages

Autor Eric Nguegang Ngnetiwe

In this study the impacts of temperature and moisture on the warpage of molded plastic packages were investigated.The investigation started with material characterizations. The influences of post-mold cure, reflow soldering, tempe ... celý popis

31.61


Skladom u dodávateľa
Odosielame za 5 - 7 dní
Pridať medzi želanie

Mohlo by sa vám tiež páčiť

Darčekový poukaz: Radosť zaručená
  1. Darujte poukaz v ľubovoľnej hodnote, a my sa postaráme o zvyšok.
  2. Poukaz sa vzťahuje na všetky produkty v našej ponuke.
  3. Elektronický poukaz si vytlačíte z e-mailu a môžete ho ihneď darovať.
  4. Platnosť poukazu je 12 mesiacov od dátumu vystavenia.

Objednať darčekový poukazViac informácií

Viac informácií o knihe Experimental and Simulation-based Investigations on the Influence of Thermal Aging and Humidity on the Warpage of Molded Plastic Packages

Nákupom získate 78 bodov

Anotácia knihy

In this study the impacts of temperature and moisture on the warpage of molded plastic packages were investigated.The investigation started with material characterizations. The influences of post-mold cure, reflow soldering, temperature cycles and high temperature storage on the material parameter (Young's modulus, coefficient of thermal expansion and glass transition temperature) of the investigated Epoxy Molding Compound (EMC) were investigated.By using test specimens (bi-material systems composed of EMC and copper, EMC and silicon) as well as real molded plastic packages (QFN packages), it was shown how material parameter changes due to thermal aging of EMC can lead to warpage changes of molded plastic packages.The impact of thermal aging on the structural changes of EMC was investigated. The oxidation layer, which developed on the surfaces of EMC due to thermal aging, was characterized. The formation of a second glass transition temperature in EMC due to thermal aging was investigated as a function of storage time and storage temperature.In the last chapter of this study, the simultaneous impact of temperature and moisture on the warpage of molded plastic packages was investigated by means of experiments and simulations.This study provides a deep understanding of warpage changes and stress changes respectively in molded plastic packages, when these are subjected to reflow soldering, temperature cycles, high temperature storage and moisture.

Parametre knihy

31.61

Obľúbené z iného súdka



Osobný odber Bratislava a 2642 dalších

Copyright ©2008-24 najlacnejsie-knihy.sk Všetky práva vyhradenéSúkromieCookies


Môj účet: Prihlásiť sa
Všetky knihy sveta na jednom mieste. Navyše za skvelé ceny.

Nákupný košík ( prázdny )

Vyzdvihnutie v Zásielkovni
zadarmo nad 59,99 €.

Nachádzate sa: