Kód: 06796145
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designe ... celý popis
251.86 €
Potrebujete viac kusov?Ak máte záujem o viac kusov, preverte, prosím, najprv dostupnosť titulu na našej zákazníckej podpore.
Nákupom získate 623 bodov
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. §Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Energy technology & engineering Electrical engineering
251.86 €
Osobný odber Bratislava a 2642 dalších
Copyright ©2008-24 najlacnejsie-knihy.sk Všetky práva vyhradenéSúkromieCookies
Nákupný košík ( prázdny )