Mohlo by sa vám tiež páčiť

Viac informácií o knihe Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

• Parametre knihy
• Anotácia kniha
• Obľúbené z iného súdka

Nákupom získate 453 bodov

Anotácia knihy

This book focuses on the design, materials, process, fabrication, and reliability of flip chip, hybrid bonding, fan-in, and fan-out technology. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as wafer bumping, flip chip assembly, underfill and reliability, chip-to-wafer, wafer-to-wafer, Cu-Cu hybrid bonding, WLCSP, 6-side molded WLCSP, FOWLP such as hybrid substrates with PID, ABF, and ultra-large organic interposer, the communications between chiplets and heterogeneous integration packaging, and on-board optics, near-package optics, and co-packaged optics.The book benefits researchers, engineers, and graduate students in the fields of electrical engineering, mechanical engineering, materials sciences, industry engineering, etc.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
• Autor: John H. Lau
• Jazyk: Angličtina
• Väzba: Pevná
• EAN: 9789819721399
• ID: 45205811
• Nakladateľ: Springer, Berlin
• Rozmery: 235 × 155 mm
• Dátum vydania: 11. September 2024

---

---

---