Kód: 39306571
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on ... celý popis
Angličtina
56.09 €
Bežne: 68.43 €
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Anotácia knihy
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
Parametre knihy
Zaradenie knihy Knihy po nemecky Naturwissenschaften, Medizin, Informatik, Technik Biologie Mikrobiologie
56.09 €
AngličtinaOsobný odber Bratislava a 12882 dalších
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