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Viac informácií o knihe Modeling and Simulation for Microelectronic Packaging Assembly

• Parametre knihy
• Anotácia kniha
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Anotácia knihy

Teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of microelectronic package assembly§Liu and Liu begin with an overview of mechanics and modeling, including modeling validation tools and an explanation of concurrent engineering. They then move on to modeling in microelectronic packaging and assembly, coving packaging and assembly for typical ICs, optoelectronics, MEMS, SIP/3D, and nano interconnects. The next section explains modeling methods for package reliability and test, followed my modern modeling and simulation methodologies.§Models and simulates numerous processes in manufacturing, reliability and testing for the first time§Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing§Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products.§Subroutines and color images available for download from the books Companion Site

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Mechanical engineering & materials Production engineering

• Celý názov: Modeling and Simulation for Microelectronic Packaging Assembly
• Podnázov: Manufacturing, Reliability and Testing
• Autor: Sheng Liu, Yong Liu
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 592
• EAN: 9780470827802
• ISBN: 0470827807
• ID: 01388967
• Nakladateľ: John Wiley & Sons Inc
• Hmotnosť: 942 g
• Rozmery: 247 × 173 × 35 mm
• Dátum vydania: 21. October 2011

Obľúbené z iného súdka

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