Kód: 01216254
This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of all key algorithms, for maximu ... celý popis
214.42 €
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This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of all key algorithms, for maximum understanding and utility.
Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Industrial chemistry & manufacturing technologies Other manufacturing technologies
214.42 €
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