Kód: 09062257
This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW ... celý popis
Angličtina
154.20 €
Bežne: 167.05 €
Ušetríte 12.86 €

Nákupom získate 373 bodov
Anotácia knihy
This book presents the latest developments in packaging for high-frequency electronics. Topics include thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods and other RF/MW packaging-related fields.§
Parametre knihy
Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
154.20 €
Angličtina
Osobný odber Bratislava a 12820 dalších
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