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Viac informácií o knihe Testing of Interposer-Based 2.5D Integrated Circuits

• Parametre knihy
• Anotácia kniha
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Anotácia knihy

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

Parametre knihy

• Celý názov: Testing of Interposer-Based 2.5D Integrated Circuits
• Autor: RAN WANG
• Jazyk: Angličtina
• Väzba: Brožovaná
• Počet strán: 182
• EAN: 9783319854618
• ISBN: 9783319854618
• ID: 19608059
• Nakladateľ: Springer International Publishing AG
• Hmotnosť: 3051 g
• Rozmery: 235 × 155 × 10 mm
• Dátum vydania: 09. May 2018

Obľúbené z iného súdka

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