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Viac informácií o knihe Assembly and Reliability of Lead-Free Solder Joints

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Anotácia knihy

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering

• Celý názov: Assembly and Reliability of Lead-Free Solder Joints
• Autor: John H. Lau, Ning-Cheng Lee
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 552
• EAN: 9789811539190
• ID: 25826473
• Nakladateľ: Springer, Berlin
• Hmotnosť: 906 g
• Rozmery: 32 × 158 × 33 mm
• Rok vydania: 2020

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