Kód: 32905881
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The ... celý popis
Angličtina
Nákupom získate 544 bodov
Anotácia knihy
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
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224.94 €
Angličtina
Osobný odber Bratislava a 12792 dalších
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