Kód: 13816997
This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testin ... celý popis
Angličtina
103.70 €
Bežne: 114.84 €
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Anotácia knihy
This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.
Parametre knihy
Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Electronics & communications engineering Electronics engineering
103.70 €
Angličtina
Osobný odber Bratislava a 12762 dalších
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