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Viac informácií o knihe Electronic Packaging for High Reliability, Low Cost Electronics

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• Anotácia kniha
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Anotácia knihy

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Mechanical engineering & materials Materials science

• Celý názov: Electronic Packaging for High Reliability, Low Cost Electronics
• Autor: Rao R. Tummala, Marija Kosec, W. Kinzy Jones, Darko Belavic
• Jazyk: Angličtina
• Väzba: Brožovaná
• Počet strán: 296
• EAN: 9789048150854
• ISBN: 904815085X
• ID: 01973862
• Nakladateľ: Springer
• Hmotnosť: 474 g
• Rozmery: 240 × 160 × 17 mm
• Dátum vydania: 02. December 2010

Obľúbené z iného súdka

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