Code: 06699473
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly M ... more
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292.66 €
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Book synopsis
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
Book details
Book category Knihy po anglicky Technology, engineering, agriculture Industrial chemistry & manufacturing technologies Other manufacturing technologies
292.66 €
English
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