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Viac informácií o knihe Materials Reliability Issues in Microelectronics: Volume 225

• Parametre knihy
• Anotácia kniha
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Anotácia knihy

With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools. This volume recognizes that almost all reliability problems are materials problems, and helps to put 'reliabilty physics' on a firm scientific foundation. Topics include: electromigration; stress effects on reliability; stress and packaging; metallization; device, oxide and dielectric reliability; new investigative techniques; corrosion.

Parametre knihy

Zaradenie knihy Knihy po anglicky Technology, engineering, agriculture Mechanical engineering & materials Production engineering

• Celý názov: Materials Reliability Issues in Microelectronics: Volume 225
• Autor: James R. LloydFrederick G. YostPaul S. Ho
• Jazyk: Angličtina
• Väzba: Pevná
• Počet strán: 382
• EAN: 9781558991194
• ISBN: 1558991190
• ID: 02059930
• Nakladateľ: Materials Research Society
• Hmotnosť: 700 g
• Rozmery: 235 × 155 × 25 mm
• Dátum vydania: 22. October 1991

Obľúbené z iného súdka

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